Mettre en évidence: 
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                High speed hot bar soldering machine, PCB bonding soldering machine, FPC board soldering machine
                              

Poids:	110 kg	Pouvoir:	10 kW
Tension:	220V/380V	Modèle:	YSPC-1A
Zone de travail:	200*260mm	Force de liaison:	3 900N
Capacité de pas:	0,25 mm	Composants de base:	PLC, boîte de vitesse, moteur, pompe
Contrôle de la température:	PID en boucle fermée	Contrôle de pression:	Programmable Numérique
Temps de cycle:	Extrêmement court	Type de thermode:	Flottant
Système d'alignement:	Micromètre/vide	CCD en option:	Cadre, appareil photo, objectif
Type de contrôleur:	à base de microprocesseur

Poids:	110 kg
Pouvoir:	10 kW
Tension:	220V/380V
Modèle:	YSPC-1A
Zone de travail:	200*260mm
Force de liaison:	3 900N
Capacité de pas:	0,25 mm
Composants de base:	PLC, boîte de vitesse, moteur, pompe
Contrôle de la température:	PID en boucle fermée
Contrôle de pression:	Programmable Numérique
Temps de cycle:	Extrêmement court
Type de thermode:	Flottant
Système d'alignement:	Micromètre/vide
CCD en option:	Cadre, appareil photo, objectif
Type de contrôleur:	à base de microprocesseur

High Speed Hot Bar Soldering Machine Bonding PCB and Fpc Board

High Speed Hot Bar Soldering Machine for PCB and FPC Board Bonding

Advanced hot bar soldering system designed for precision bonding of printed circuit boards and flexible printed circuits with exceptional speed and accuracy.

Technical Details

Microprocessor-based controller provides precise and consistent temperature control
Unique pulsed heat thermos offers uniform temperature distribution with fast heating and cool-down
Flexible programmable profiles for targeted idle, preheat and reflow heating
Floating thermos and digital pressure switch ensure optimal pressure distribution across joints
CCD camera system with magnification lens available for fine-pitch positioning

Key Features

Extremely short cycle time with rotary table design
Product loading and unloading during heat sealing process
High quality heat seal application up to 0.25mm pitch
Pneumatic bonding head provides up to 3,900N force
Digital programmable pressure control with LCD display
Closed loop PID temperature control with visible LED display
Bonding cycle triggered by real-time pressure sensor
Floating Thermode ensures consistent pressure and heat transfer
Precision product fixtures with micrometer alignment and vacuum component fixation
Optional CCD alignment module for fine pitch applications
Full microprocessor logic control

Customer Support Advantages

Engineer overseas training for customers
Prompt technical support services
Rapid complaint handling with 30-minute response time
Reliable manufacturing with 15+ experts each having over six years of experience

Technical Specifications